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| English | Russian |
| flip chip packaging | монтаж методом перевёрнутой микросхемы (A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins) |
| on-chip performance counter | аппаратный счётчик производительности (A register on a CPU chip that stores very low-level information. This information can be queried. Rori) |
| system on a chip | система на кристалле (A chip that integrates most of all of the basic components of a computer, including microprocessors and necessary support components. SOC technology is used in firewalls, gateways, specialized servers, and interactive devices) |