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| build-up process (разновидность технологии изготовления многослойных печатных плат; A manufacturing method for multilayered print substrates. Multilayer substrates are formed by repeating lamination, punching and wiring for each layer Antibus) | |||
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| build-up process (разновидность технологии изготовления многослойных печатных плат; A manufacturing method for multilayered print substrates. Multilayer substrates are formed by repeating lamination, punching and wiring for each layer Antibus) | |||